СУЧАСНІ ТЕХНОЛОГІЇ ПОЛІРУВАННЯ КРИХКИХ ТА ПЛАСТИЧНИХ МАТЕРІАЛІВ (ОГЛЯД)
DOI:
https://doi.org/10.31319/2519-2884.45.2024.4Ключові слова:
хіміко-механічне полірування, оксид церію, рідкі суспензії, твердофазні хімічні реакції, мікрошліфувальні інструменти, шорсткість обробленої поверхніАнотація
У статті проаналізовано сучасні розробки в технологіях полірування широкої гами сучасних крихких та пластичних матеріалів. Хіміко-механічне полірування (Chemical-mechanical polishing — CMP) є методом вирівнювання, який враховує як локальні, так і глобальні аспекти матеріалів, що забезпечує мікромасштабне видалення матеріалів за рахунок синергії поверхневих хімічних речовин, хімічної реакції і механічного впливу. Аналіз даних за методом CMP виробів з різних матеріалів дозволив встановити, що він базується на синергетичній дії зміненого абразиву, переважно на основі CeO2, та додання хімічних реакцій використанням рідких суспензій або твердофазних хімічних реакцій, а також на розробці нових мікрошліфувальних інструментів. Показано, що в цілому метод CMP з різними модифікаціями дозволяє отримати для матеріалів різної твердості майже однакові, фактично граничні за нижнім рівнем, показники шорсткості поверхні за параметром Sa: для плавленого кремнезему 0,124 nm, для кремнію 0,1 nm та — 0,1 nm для м’якої міді.
Посилання
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Junji Murata, Kenshin Hayama, Masaru Takizawa. (2023) Environment-friendly electrochemical mechanical polishing using solid polymer electrolyte/CeO2 composite pad for highly efficient finishing of 4H-SiC (0001) surface. Applied Surface Science. Volume 625, 15 July, 157190.
Hongfei Tao, Qinyang Zeng, Yuanhang Liu, Dewen Zhao, Xinchun Lu. (2023) Effects of grinding-induced surface topography on the material removal mechanism of silicon chemical mechanical polishing. Applied Surface Science. Volume 631, 15 September, 157509.
Guangyue Bi, Yuzhu Li, Min Lai, Fengzhou Fang. (2023) Mechanism of polishing lutetium oxide single crystals with polyhedral diamond abrasive grains based on molecular dynamics simulation. Applied Surface Science. Volume 616, 15 April, 156549.
Wan Wang, Dongpeng Hua, Qing Zhou, Shuo Li, Stefan J. Eder, Junqin Shi, Zhijun Wang, Haifeng Wang, Weimin Liu. (2023) Effect of a water film on the material removal behavior of Invar during chemical mechanical polishing. Applied Surface Science. Volume 616, 15 April, 156490.
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Junyun Chen, Zihao Lin, Tianye Jin, Bing Liu, Anmin Nie. (2023) Study on incompatible mechanism in chemical mechanical polishing of the novel graphite/diamond composite. Applied Surface Science. Volume 641, 30 December, 158500.
Mufang Zhou, Yuanyao Cheng, Min Zhong, Wenhu Xu. (2023) Macro and micro-nano machining mechanism for ultrasonic vibration assisted chemical mechanical polishing of sapphire. Applied Surface Science.Volume 640, 15 December, 158343.
Yu Zhang, Renke Kang, Jiawei Ren, Hongye Lang, Shang Gao. (2023) Mechanical effect of abrasives on silicon surface in chemo-mechanical grinding. International Journal of Mechanical Sciences. Volume 257, 1 November, 108544.
Wei Li, Shiqiang Xie, Zhengyang Deng,. Dongbo Zhou, Maojun Li, Xudong Guo, Wei Tang. (2023) Novel designed mechanical-mechanochemical synergistic micro-grinding technology and compounded abrasive micro-grinding tools. Journal of Materials Research and Technology. Volume 25, July–August, Pages 3365-3381.
Jiahuan Wang, Zewei Tang, Saurav Goel, Yu Zhou, Yanfei Dai, Jinhu Wang, Qiankun He, Julong Yuan, Binghai Lyu (2023) Mechanism of material removal in tungsten carbide-cobalt alloy during chemistry enhanced shear thickening polishing. Journal of Materials Research and Technology.Volume 25, July–August, Pages 6865-6879.
Yayoi Tanaka, Hisashi Sato, Osamu Eryu. (2022) Improved cemented carbide tool edge formed by solid phase chemical–mechanical polishing. Journal of Materials Research and Technology. Volume 20, September–October, Pages 606-615.
Xiaolong Ke, Wei Wu, Chenchun Shi, Kangsen Li, Yongheng Yu, Tianyi Wang, Bo Zhong, Zhenzhong Wang, Jiang Guo, Chi Fai Cheung, Chunjin Wang (2023) Theoretical and experimental investigation of material removal in semi-rigid bonnet polishing of binderless tungsten carbide. Journal of Materials Research and Technology. Volume 24, May–June, Pages 1597-1611.
Dongdong Liu, Zhenyu Zhang, Hongxiu Zhou, Xingqiao Deng, Chunjing Shi, Fanning Meng, Zhibin Yu, Junyuan Feng. (2023) Angstrom surface on copper induced by novel green chemical mechanical polishing using ceria and silica composite abrasives. Applied Surface Science. Volume 640, 15 December, 158382.
Weihao Ma, Jiahui Li, Xi Hou. (2023) Rolling model analysis of material removal in elastic emission machining. International Journal of Mechanical Sciences. Volume 258, 15 November, 108572.
Peng Lyu, Min Lai, Ze Liu, Fengzhou Fang. (2023) Atomic and close-to-atomic scale polishing of Lu2O3 by plasma-assisted etching. International Journal of Mechanical Sciences. Volume 252, 15 August, 108374.